We have developed new breakthroughs in processing substrate-based ultra-miniaturized circuits. The additive processes used are an alternative to traditional chemical etching, which causes circuit lines to slope, resulting in performance variations and yield issues. 

Using these new additive fabrication techniques, we can now manufacture circuits in high volume with properties that include:
-Circuit lines and spaces as small as 10 microns
-Vias as small as 25 microns in diameter
-Plated through holes (PTHs) to ground with “metal-backed” ceramics
-Multilayer devices with up to six metal layers

Additive fabrication defines circuit lines by electroplating or sputtering metal traces onto either a rigid substrate in a single layer device or onto a polyimide layer in a multilayer device. The technique achieves extreme uniformity in geometries as well as the ability to deposit exactly the desired amount of metal in exactly the desired location.

The fabrication process is ideal for applications such as aerospace, defense, telecommunications, commercial printing and photonics. It works with a wide variety of substrates and conductive materials which can be laser cut to any shape and can include through-hole geometry.